Hitachi Energy - Power semiconductors: RoadPak SiC module for e-mobility
RoadPak
SiC MOSFET
5SFG 1150B121001
RoadPak SiC phase leg module 1200 V, 1150 A*
VDSS = 1200 V
ID = 2 x 1150 A*
Molded package optimized for e-Mobility application
Pin-fin structure for lowest thermal resistance
Lowest losses thanks to Silicon Carbide chip set
Main terminals with holes for screw connection or without holes for welding
The RoadPak is our latest innovative solution for all electromobility applications.
Thanks to the latest generation of SiC MOSFET chipsets and improved liquid cooling through the pin-fin baseplate, it enables the design of converters with the lowest total leakage inductance.
In addition, the RoadPak enables very simple low-inductance connections so that the current output of the inverters can be increased with just one type of module.
This allows RoadPak to be used in a clearly defined inverter portfolio based on different power classes.
RoadPak applications include:
Main drivetrain for xEVs
E-trucks, e-buses
Auxiliary traction converter and power electronics for xEV charging